Next Generation 224-Gbps Highest-Speed Electrical I/O & Link Systems

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Originally Aired - Tuesday, August 17 2:00 PM - 2:40 PM

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Event Location

Location: Meeting Room 211AB


Event Information

Title: Next Generation 224-Gbps Highest-Speed Electrical I/O & Link Systems

Event Type: DesignCon - Technical Session

Pass Type: All-Access Pass, 2-Day Pass


Description

This paper presents the challenges and solution options in order to achieve the next generation 224 Gbps, the highest speed/data rate per lane electrical I/O and link system. The paper will focus on the 224 Gbps and long reach (LR) channel applications. The paper will start with reviewing the 112G-LR channels with package included, and discuss how its performance and signal integrity impairments (e.g., loss, xtalk, and impedance/reflection) can be improved when the data rate increases to 224 Gbps. With the projected 224G-LR channels, we will discuss the appropriate modulation option(s) that can meet the performance and solution space of the I/O and link system. We will focus on PAMn modulation, start with PAM4, and extend the investigations to PAMn where n4. The process of determining the optimal modulations need to have assumptions on SERDES analog front-end (AFE), PLL/CDR, and architecture. We will assume ADC/DAC based full-digital SERDES architecture and associated jitter/noise and parasitic likely to be at the 224 Gbps era, supported by appropriate process nodes at the time. Moreover, we will assume that 224G-LR link systems are protected by a FEC such as the commonly used KP FEC (i.e., RS(544, 514)) for 56G-PAM4 and 112G-PAM4, and explore alternative/higher coding gain  FECs that can relax the pre-FEC BER to be higher than 1e-4. The FEC trade-off options considering performance, power, and latency will be discussed. Once the optimal modulation option is determined, we will further exam its TX and RX characteristics and capabilities, and discuss how the interoperability can be achieved, and how can the new findings be applied to the future Ethernet and OIF/CEI standard developments


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