Innovative Designs for Optimizing 112G+ BGA Fan-out And Connector Footprint Crosstalk

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Originally Aired - Wednesday, August 18 11:10 AM - 11:50 AM

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Event Location

Location: Exec Ballroom 210C


Event Information

Title: Innovative Designs for Optimizing 112G+ BGA Fan-out And Connector Footprint Crosstalk

Event Type: DesignCon - Technical Session

Pass Type: All-Access Pass, 2-Day Pass

Theme: 5G


Description

As the SerDes speed is reaching 112Gbps and beyond, crosstalk energy increases greatly. The reason is that crosstalk usually has higher coupling energy in the high-frequency region. The far-end crosstalk energy will decrease dramatically after attenuation through the system link. However, the near-end crosstalk energy will couple to the receiver almost without attenuation.  The passive system crosstalk mainly comes form BGA component, transmission line component and connector component. This paper aims at optimizing the crosstalk of BGA component. The potential crosstalk sources in the BGA area include the coupling of one differential-line to another differential-hole, the coupling of one differential-line to another differential-pad, and the coupling of one differential-hole to another differential-hole. As BGA pitch decreases, the noise generated by these crosstalk sources gradually increase.Therefore, it becomes an inevitable challenge to implement the 112 G+ system.We propose a new routing structure which can reduce the coupling between transmission line and other passive components.We also propose a novel fan-out design, where the coupling between two pairs of differential holes is reduced


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