Signal Integrity Analysis in Immersion Liquid Cooling

Event Time

Originally Aired - Wednesday, August 18 2:00 PM - 2:40 PM

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Event Location

Location: Meeting Room 212AB


Event Information

Title: Signal Integrity Analysis in Immersion Liquid Cooling

Event Type: DesignCon - Technical Session

Pass Type: All-Access Pass, 2-Day Pass

Theme: Autonomous


Description

With the development of high-density, high-power chips and data rate in the future, immersion liquid cooling will be an effective method for energy saving in data center. The method is to submerge computer components (or full servers) in a thermally, but not electrically, conductive liquid (dielectric coolant). The advantages of immersion liquid cooling not only saves air conditioners and fans in the data center, but also improves system reliability, reduces failure rate (especially for heat-sensitive components such as HDD, etc.).

In recent years, data rate has evolved to 112Gbps, and the requirements for system design will become higher and higher. In immersion liquid cooling, the environment material changes from air to liquid, which brings a new challenge to signal integrity of electronic components and interconnected components inevitably.


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