Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than thirty years in areas related to both commercial and aerospace electronic products and is active as an author and educator. Vern holds several patents for IC packaging innovations including the folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication, columnist for PCB007 Magazine and instructor supporting several industry organization technical programs, including IPC and SMTA.
- Tutorial — PCB Design Principles for Implementing High-Density Semiconductor Package Technology, WLP, PLP, 2D, 2.5D & 3D
- Monday, August 16 • 1:45 PM - 4:15 PM