Wei (Brian) He is currently a leading application engineer with Xpeedic Technology, Inc. Prior to joining Xpeedic in 2018, he worked at Huawei Technologies from 2007 to 20He is responsible for high speed end-to-end interconnection simulation and measurement techniques within High speed Interconnect Research Group. He received his bachelor degree in electronic science and technology from Xi'an electronic science and technology University of China in 2005.
- Signal Integrity Analysis in Immersion Liquid Cooling
- Wednesday, August 18 • 2:00 PM - 2:40 PM